COMPLETE TESTING SOLUTION
EGSE EQUIPMENT AND COMPONENTS
COTS and Custom Chassis
Available COTS Digital Isolation, OVP/OCP Protection, and Static Load chassis. Custom chassis can be ordered.
![](https://baengineering.com/wp-content/uploads/2021/11/full-chas.png)
![](https://baengineering.com/wp-content/uploads/2021/11/new-icon.png)
SLSC Modules / Test Boards
Pre-engineered customizable OVP/OCP, Digital Isolation, Static Load, and other types of Modules.
![](https://baengineering.com/wp-content/uploads/2021/11/400-card.png)
CABLES AND HARNESSES
EGSE Flight Cables
TVAC compatible cables capable of withstanding extreme environmental conditions. Thermal Vacuum Bake-Out per NASA MSFC-SPEC-1238 standard available.
![20210806_141550-TBG](https://baengineering.com/wp-content/uploads/2021/11/20210806_141550-TBG.png)
![20210806_142009-1-TBG](https://baengineering.com/wp-content/uploads/2021/11/20210806_142009-1-TBG.png)
Non-Flight Cables
EGSE, BOB, and custom cables. BOB Cable order tool with pre-engineered drawings available on website.
![20210806_143015-TBG](https://baengineering.com/wp-content/uploads/2021/11/20210806_143015-TBG.png)
![20210806_143241-1-TBG](https://baengineering.com/wp-content/uploads/2021/11/20210806_143241-1-TBG.png)
COTS TEST EQUIPMENT AND OTHER PRODUCTS
Break-Out-Box (BOB)
Certified for use on flight hardware. Available in different colors and configurations, customization available.
![BOB Colors](https://baengineering.com/wp-content/uploads/2020/04/bob.jpg)
![blue-bob-front](https://baengineering.com/wp-content/uploads/2020/04/blue-bob-front.jpg)
![NGC BOB](https://baengineering.com/wp-content/uploads/2020/07/NGC-BOB-scaled.jpg)
![NGC BOB-3](https://baengineering.com/wp-content/uploads/2020/07/NGC-BOB-3-scaled.jpg)
FPGA Signal Analyzer
Debug in real time by using Xilinx ChipScope Pro software and Xilinx Platform Cable USB JTAG interface.
![](https://baengineering.com/wp-content/uploads/2021/11/400-fpga.png)